Electronic Devices Circuits Transistor Case Heat Sinks Online Exam Quiz
Electronic Devices Circuits Transistor Case Heat Sinks GK Quiz. Question and Answers related to Electronic Devices Circuits Transistor Case Heat Sinks. MCQ (Multiple Choice Questions with answers about Electronic Devices Circuits Transistor Case Heat Sinks
How can one decrease the spreading resistance in the base of the heat sink?
Options
A : Increase the base thickness.
B : Decrease the base thickness.
C : Choosing a material with less conductivity.
D : There is no possible way.
Which of the following characteristics makes passive heat sinks differently from active heat sinks?
Options
A : It possess mechanical components
B : It possess electrical components
C : Does not possess mechanical components
D : It possess electrical & mechanical components
How can a pin fin heat sink be classified on the basis of fin arrangements?
Options
A : Pin, straight pin, flared pin
B : Pin, circular pin, cylindrical pin
C : Straight pin, circular pin, isotopic pin
D : No classification
Heat sinks work through the process of _______
Options
A : resistive heat transfer
B : conductive and convection heat transfer
C : active process
D : no heat transfer
Which of the following is not an application of transistor heat sinks?
Options
A : Soldering
B : Light Emitting Diode Lamps
C : Microprocessor Cooling
D : Environment Monitoring Systems
_______are usually utilized to extract heat from a variety of heat generating bodies to a heat sink.
Options
A : square fins
B : cylindrical fins
C : cavities
D : no option
The epoxy bond between the heat sink and component is __________
Options
A : Temporary
B : Loosened
C : Permanent/semi-permanent
D : Highend
Why does the heat sink has fins?
Options
A : to provide cooling to the processor
B : to provide airflow to the radiator
C : to preserve the energy
D : to provide radiator to the airflow
Copper has around twice the thermal conductivity of aluminum.
Options
A : True
B : False
C :
D :
Fin efficiency is increased by_______
Options
A : Using insulating material
B : Decreasing the fin aspect ratio
C : Using more conductive material
D : Decreasing the fin aspect ratio & Using more conductive material
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